Publication:

3D TSV based high frequency components for RF IC and RF MEMS applications

Date

2016

Proceedings Paper

Simple item page Full metadata Statistics

Files

35335.pdf 1.58 MB

Author(s)

Fernandez-Bolanos, Montserrat

;

Vitale, Wolfgang

;

Maqueda Lopez, Mariazel

;

Ionescu, Adrian M.

;

;

De Raedt, Walter

;

;

;

;

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Metrics

1975 since deposited on 2021-10-23

2last month

Acq. date: 2025-12-11