Publication:

Reduced resistivity of NiAl by backthinning for advanced interconnect metallization

Date

2023
Proceedings Paper
https://doi.org/10.1109/IITC/MAM57687.2023.10154878
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Published version 2.2 MB

Author(s)

Soulie, Jean-Philippe
;
Tokei, Zsolt  
;
Heylen, Nancy  
;
Adelmann, Christoph  

Journal

IEEE International Interconnect Technology Conference (IITC) / IEEE Materials for Advanced Metallization Conference (MAM)

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1194 since deposited on 2023-08-07
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1 since deposited on 2023-08-07
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1194 since deposited on 2023-08-07
Acq. date: 2025-10-27

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