Publication:

Reduced resistivity of NiAl by backthinning for advanced interconnect metallization

Date

2023
Proceedings Paper
https://doi.org/10.1109/IITC/MAM57687.2023.10154878
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cris.virtual.orcid0000-0002-5956-6485
cris.virtual.orcid0000-0003-3545-3424
cris.virtual.orcid0009-0008-0490-0993
cris.virtual.orcid0000-0002-4831-3159
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cris.virtualsource.department5345513e-14d5-47e9-a494-1dda4ed18864
cris.virtualsource.department713e2686-2dbb-46e6-8f45-77474e694e21
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cris.virtualsource.orcid3e839b18-b9e5-46f9-95d4-760837031f7a
dc.contributor.authorSoulie, Jean-Philippe
dc.contributor.authorTokei, Zsolt
dc.contributor.authorHeylen, Nancy
dc.contributor.authorAdelmann, Christoph
dc.contributor.imecauthorSoulie, Jean-Philippe
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorAdelmann, Christoph
dc.contributor.orcidimecSoulie, Jean-Philippe::0000-0002-5956-6485
dc.contributor.orcidimecAdelmann, Christoph::0000-0002-4831-3159
dc.contributor.orcidimecTokei, Zsolt::0000-0003-3545-3424
dc.contributor.orcidimecHeylen, Nancy::0009-0008-0490-0993
dc.date.accessioned2023-08-11T12:53:01Z
dc.date.available2023-08-07T17:07:24Z
dc.date.available2023-08-11T12:53:01Z
dc.date.embargo9999-12-31
dc.date.issued2023
dc.description.wosFundingTextThe authors would like to thank M. Gade, O. Richard and L. Nelissen for the TEM/EDS analysis; I. Hoflijk and T. Conard for the XPS analysis. This work has been supported by imec's industrial affiliate program 011 nano-interconnects.
dc.identifier.doi10.1109/IITC/MAM57687.2023.10154878
dc.identifier.eisbn979-8-3503-1097-9
dc.identifier.issn2380-632X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42288
dc.publisherIEEE
dc.source.conferenceIEEE International Interconnect Technology Conference (IITC) / IEEE Materials for Advanced Metallization Conference (MAM)
dc.source.conferencedateMAY 22-25, 2023
dc.source.conferencelocationDresden
dc.source.journalIEEE International Interconnect Technology Conference (IITC) / IEEE Materials for Advanced Metallization Conference (MAM)
dc.source.numberofpages3
dc.title

Reduced resistivity of NiAl by backthinning for advanced interconnect metallization

dc.typeProceedings paper
dspace.entity.typePublication
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