Publication:

Impact of Pitch Scaling on 3D Die-to-Die Interconnects

Date

2024

Proceedings Paper

https://doi.org/10.1109/ECTC51529.2024.00171

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Author(s)

Pantano, Nicolas

;

Stucchi, Michele

;

Van der Plas, Geert

;

Journal

N/A

Statistics

264 since deposited on 2024-12-07

Acq. date: 2026-02-25