Publication:

Impact of Pitch Scaling on 3D Die-to-Die Interconnects

Date

2024
Proceedings Paper
https://doi.org/10.1109/ECTC51529.2024.00171
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dc.contributor.authorPantano, Nicolas
dc.contributor.authorStucchi, Michele
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorPantano, Nicolas
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecPantano, Nicolas::0000-0002-8803-8374
dc.contributor.orcidimecStucchi, Michele::0000-0002-7848-0492
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2025-04-10T15:03:57Z
dc.date.available2024-12-07T16:58:03Z
dc.date.available2025-04-10T15:03:57Z
dc.date.issued2024
dc.identifier.doi10.1109/ECTC51529.2024.00171
dc.identifier.eisbn979-8-3503-7598-5
dc.identifier.isbn979-8-3503-7599-2
dc.identifier.issn0569-5503
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44951
dc.publisherIEEE COMPUTER SOC
dc.source.beginpage1064
dc.source.conferenceIEEE 74th Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateMAY 28-31, 2024
dc.source.conferencelocationDenver
dc.source.endpage1071
dc.source.journalN/A
dc.source.numberofpages8
dc.title

Impact of Pitch Scaling on 3D Die-to-Die Interconnects

dc.typeProceedings paper
dspace.entity.typePublication
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