Publication:
Al3Sc thin films as alternative interconnect metallization
Date
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.orcid | 0000-0002-5956-6485 | |
| cris.virtual.orcid | 0000-0001-7547-7194 | |
| cris.virtual.orcid | 0000-0003-3545-3424 | |
| cris.virtual.orcid | 0000-0002-4831-3159 | |
| cris.virtualsource.department | c1bbf7c6-fe00-4d3e-9b77-5ac76d18c50a | |
| cris.virtualsource.department | 5afcb429-ac38-4c13-8422-3088287ba9bd | |
| cris.virtualsource.department | 5345513e-14d5-47e9-a494-1dda4ed18864 | |
| cris.virtualsource.department | 3e839b18-b9e5-46f9-95d4-760837031f7a | |
| cris.virtualsource.orcid | c1bbf7c6-fe00-4d3e-9b77-5ac76d18c50a | |
| cris.virtualsource.orcid | 5afcb429-ac38-4c13-8422-3088287ba9bd | |
| cris.virtualsource.orcid | 5345513e-14d5-47e9-a494-1dda4ed18864 | |
| cris.virtualsource.orcid | 3e839b18-b9e5-46f9-95d4-760837031f7a | |
| dc.contributor.author | Soulie, Jean-Philippe | |
| dc.contributor.author | Adelmann, Christoph | |
| dc.contributor.author | Swerts, Johan | |
| dc.contributor.author | Tokei, Zsolt | |
| dc.contributor.imecauthor | Soulie, Jean-Philippe | |
| dc.contributor.imecauthor | Adelmann, Christoph | |
| dc.contributor.imecauthor | Swerts, Johan | |
| dc.contributor.imecauthor | Tokei, Zsolt | |
| dc.contributor.orcidimec | Soulie, Jean-Philippe::0000-0002-5956-6485 | |
| dc.contributor.orcidimec | Adelmann, Christoph::0000-0002-4831-3159 | |
| dc.contributor.orcidimec | Swerts, Johan::0000-0001-7547-7194 | |
| dc.contributor.orcidimec | Tokei, Zsolt::0000-0003-3545-3424 | |
| dc.date.accessioned | 2024-01-16T11:11:33Z | |
| dc.date.available | 2022-10-10T09:51:39Z | |
| dc.date.available | 2024-01-16T11:11:33Z | |
| dc.date.embargo | 9999-12-31 | |
| dc.date.issued | 2022-03-28 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/40549 | |
| dc.source.conference | MAM 2022 | |
| dc.source.conferencedate | 2022-03-28 | |
| dc.source.conferencelocation | Leuven | |
| dc.subject.keywords | interconnect | |
| dc.subject.keywords | nano IC | |
| dc.subject.keywords | aluminides | |
| dc.title | Al3Sc thin films as alternative interconnect metallization | |
| dc.type | Oral presentation | |
| dspace.entity.type | Publication | |
| Files | Original bundle
| |
| Publication available in collections: |