Publication:

Al3Sc thin films as alternative interconnect metallization

Date

2022-03-28
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dc.contributor.authorSoulie, Jean-Philippe
dc.contributor.authorAdelmann, Christoph
dc.contributor.authorSwerts, Johan
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorSoulie, Jean-Philippe
dc.contributor.imecauthorAdelmann, Christoph
dc.contributor.imecauthorSwerts, Johan
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecSoulie, Jean-Philippe::0000-0002-5956-6485
dc.contributor.orcidimecAdelmann, Christoph::0000-0002-4831-3159
dc.contributor.orcidimecSwerts, Johan::0000-0001-7547-7194
dc.contributor.orcidimecTokei, Zsolt::0000-0003-3545-3424
dc.date.accessioned2024-01-16T11:11:33Z
dc.date.available2022-10-10T09:51:39Z
dc.date.available2024-01-16T11:11:33Z
dc.date.embargo9999-12-31
dc.date.issued2022-03-28
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40549
dc.source.conferenceMAM 2022
dc.source.conferencedate2022-03-28
dc.source.conferencelocationLeuven
dc.subject.keywordsinterconnect
dc.subject.keywordsnano IC
dc.subject.keywordsaluminides
dc.title

Al3Sc thin films as alternative interconnect metallization

dc.typeOral presentation
dspace.entity.typePublication
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