Publication:

Collective die-to-wafer assembly process for optically interconnected System-on-wafer

Date

2024

Proceedings Paper

https://doi.org/10.1109/ECTC51529.2024.00227

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Author(s)

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Dvoretskii, Anton

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Golshani, Negin

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Verheyen, Peter

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Magdziak, Rafal

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Bipul, Swetanshu

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Phommahaxay, Alain

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Chakrabarti, Maumita

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Ferraro, Filippo

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van Campenhout, Joris

Journal

N/A

Statistics

438 since deposited on 2024-12-07

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Acq. date: 2026-03-16