Publication:
Collective die-to-wafer assembly process for optically interconnected System-on-wafer
| dc.contributor.author | Kennes, Koen | |
| dc.contributor.author | Dvoretskii, Anton | |
| dc.contributor.author | Podpod, Arnita | |
| dc.contributor.author | Xu, Pengfei | |
| dc.contributor.author | He, Junwen | |
| dc.contributor.author | Lepage, Guy | |
| dc.contributor.author | Golshani, Negin | |
| dc.contributor.author | Verheyen, Peter | |
| dc.contributor.author | Magdziak, Rafal | |
| dc.contributor.author | Bipul, Swetanshu | |
| dc.contributor.author | Phommahaxay, Alain | |
| dc.contributor.author | Chakrabarti, Maumita | |
| dc.contributor.author | Miller, Andy | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | Ban, Yoojin | |
| dc.contributor.author | Ferraro, Filippo | |
| dc.contributor.author | van Campenhout, Joris | |
| dc.contributor.imecauthor | Kennes, Koen | |
| dc.contributor.imecauthor | Dvoretskii, Anton | |
| dc.contributor.imecauthor | Podpod, Arnita | |
| dc.contributor.imecauthor | Xu, Pengfei | |
| dc.contributor.imecauthor | He, Junwen | |
| dc.contributor.imecauthor | Lepage, Guy | |
| dc.contributor.imecauthor | Verheyen, Peter | |
| dc.contributor.imecauthor | Magdziak, Rafal | |
| dc.contributor.imecauthor | Bipul, Swetanshu | |
| dc.contributor.imecauthor | Phommahaxay, Alain | |
| dc.contributor.imecauthor | Chakrabarti, Maumita | |
| dc.contributor.imecauthor | Miller, Andy | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.imecauthor | Ban, Yoojin | |
| dc.contributor.imecauthor | Ferraro, Filippo | |
| dc.contributor.imecauthor | van Campenhout, Joris | |
| dc.contributor.imecauthor | Golshani, Negin | |
| dc.contributor.orcidimec | Kennes, Koen::0000-0002-5987-2167 | |
| dc.contributor.orcidimec | Dvoretskii, Anton::0009-0003-0931-1614 | |
| dc.contributor.orcidimec | Podpod, Arnita::0009-0005-1890-570X | |
| dc.contributor.orcidimec | Lepage, Guy::0000-0002-3883-4452 | |
| dc.contributor.orcidimec | Verheyen, Peter::0000-0002-8245-9442 | |
| dc.contributor.orcidimec | Magdziak, Rafal::0009-0007-0378-302X | |
| dc.contributor.orcidimec | Bipul, Swetanshu::0000-0002-2701-8505 | |
| dc.contributor.orcidimec | Phommahaxay, Alain::0000-0001-8672-2386 | |
| dc.contributor.orcidimec | Chakrabarti, Maumita::0000-0003-4584-0399 | |
| dc.contributor.orcidimec | Miller, Andy::0000-0001-7048-2242 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.contributor.orcidimec | Ban, Yoojin::0000-0001-7319-8132 | |
| dc.contributor.orcidimec | Ferraro, Filippo::0000-0002-9328-5548 | |
| dc.contributor.orcidimec | Van Campenhout, Joris::0000-0003-0778-2669 | |
| dc.contributor.orcidimec | Golshani, Negin::0000-0002-1299-0641 | |
| dc.date.accessioned | 2025-02-11T10:44:00Z | |
| dc.date.available | 2024-12-07T16:57:02Z | |
| dc.date.available | 2025-02-11T10:44:00Z | |
| dc.date.issued | 2024 | |
| dc.description.wosFundingText | This work was supported by imec's industry-affiliation R&D program "Optical I/O". | |
| dc.identifier.doi | 10.1109/ECTC51529.2024.00227 | |
| dc.identifier.eisbn | 979-8-3503-7598-5 | |
| dc.identifier.isbn | 979-8-3503-7599-2 | |
| dc.identifier.issn | 0569-5503 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/44937 | |
| dc.publisher | IEEE COMPUTER SOC | |
| dc.source.beginpage | 1392 | |
| dc.source.conference | IEEE 74th Electronic Components and Technology Conference (ECTC) | |
| dc.source.conferencedate | MAY 28-31, 2024 | |
| dc.source.conferencelocation | Denver | |
| dc.source.endpage | 1397 | |
| dc.source.journal | N/A | |
| dc.source.numberofpages | 6 | |
| dc.title | Collective die-to-wafer assembly process for optically interconnected System-on-wafer | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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