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Above-IC generic poly-SiGe thin film wafer level packaging and MEM device technology: application to accelerometers
Publication:
Above-IC generic poly-SiGe thin film wafer level packaging and MEM device technology: application to accelerometers
Date
2011
Proceedings Paper
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21918.pdf
2.43 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Guo, Bin
;
Wen, Lianggong
;
Helin, Philippe
;
Claes, Gert
;
Verbist, Agnes
;
Van Hoof, Rita
;
Du Bois, Bert
;
De Coster, Jeroen
;
De Wolf, Ingrid
;
Shahar, Abdul Hadi
;
Li, Yunlong
;
Cui, Hushan
;
Lux, Marcel
;
Vereecke, Guy
;
Tilmans, Harrie
;
Haspeslagh, Luc
;
Decoutere, Stefaan
;
Osman, Haris
;
Puers, Bob
;
Severi, Simone
;
Witvrouw, Ann
Journal
Abstract
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Views
2014
since deposited on 2021-10-19
Acq. date: 2025-10-23
Citations
Metrics
Views
2014
since deposited on 2021-10-19
Acq. date: 2025-10-23
Citations