Publication:

Above-IC generic poly-SiGe thin film wafer level packaging and MEM device technology: application to accelerometers

Date

2011
Proceedings Paper
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dc.contributor.authorGuo, Bin
dc.contributor.authorWen, Lianggong
dc.contributor.authorHelin, Philippe
dc.contributor.authorClaes, Gert
dc.contributor.authorVerbist, Agnes
dc.contributor.authorVan Hoof, Rita
dc.contributor.authorDu Bois, Bert
dc.contributor.authorDe Coster, Jeroen
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorShahar, Abdul Hadi
dc.contributor.authorLi, Yunlong
dc.contributor.authorCui, Hushan
dc.contributor.authorLux, Marcel
dc.contributor.authorVereecke, Guy
dc.contributor.authorTilmans, Harrie
dc.contributor.authorHaspeslagh, Luc
dc.contributor.authorDecoutere, Stefaan
dc.contributor.authorOsman, Haris
dc.contributor.authorPuers, Bob
dc.contributor.authorSeveri, Simone
dc.contributor.imecauthorHelin, Philippe
dc.contributor.imecauthorVan Hoof, Rita
dc.contributor.imecauthorDu Bois, Bert
dc.contributor.imecauthorDe Coster, Jeroen
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorShahar, Abdul Hadi
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorLux, Marcel
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.imecauthorHaspeslagh, Luc
dc.contributor.imecauthorDecoutere, Stefaan
dc.contributor.imecauthorOsman, Haris
dc.contributor.imecauthorPuers, Bob
dc.contributor.imecauthorSeveri, Simone
dc.contributor.orcidimecDu Bois, Bert::0000-0003-0147-1296
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.contributor.orcidimecDecoutere, Stefaan::0000-0001-6632-6239
dc.date.accessioned2021-10-19T14:03:40Z
dc.date.available2021-10-19T14:03:40Z
dc.date.embargo9999-12-31
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19023
dc.source.beginpage352
dc.source.conferenceIEEE 24th International Conference on Micro Electro Mechanical Systems - MEMS
dc.source.conferencedate23/01/2011
dc.source.conferencelocationCancun Mexico
dc.source.endpage355
dc.title

Above-IC generic poly-SiGe thin film wafer level packaging and MEM device technology: application to accelerometers

dc.typeProceedings paper
dspace.entity.typePublication
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