Publication:

Development of glyoxylic acid based electroless copper deposition on ruthenium

Date

2015
Proceedings Paper
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dc.contributor.authorInoue, Fumihiro
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorArmini, Silvia
dc.contributor.authorStruyf, Herbert
dc.contributor.authorShingubara, Shoso
dc.contributor.authorTanaka, Tetsu
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.date.accessioned2021-10-22T19:50:33Z
dc.date.available2021-10-22T19:50:33Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25414
dc.identifier.urlhttp://ecst.ecsdl.org/content/64/40/41.full.pdf
dc.source.beginpage41
dc.source.conferenceProcessing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6
dc.source.conferencedate5/10/2014
dc.source.conferencelocationCancun Mexico
dc.source.endpage55
dc.title

Development of glyoxylic acid based electroless copper deposition on ruthenium

dc.typeProceedings paper
dspace.entity.typePublication
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