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A comprehensive LER-aware TDDB lifetime model for advanced Cu interconnects
Publication:
A comprehensive LER-aware TDDB lifetime model for advanced Cu interconnects
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Date
2011
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Stucchi, Michele
;
Roussel, Philippe
;
Tokei, Zsolt
;
Demuynck, Steven
;
Groeseneken, Guido
Journal
IEEE Transactions on Device and Materials Reliability
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1970
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Acq. date: 2025-12-15
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Views
1970
since deposited on 2021-10-19
1
last month
Acq. date: 2025-12-15
Citations