Publication:

A comprehensive LER-aware TDDB lifetime model for advanced Cu interconnects

Date

2011
Journal article
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dc.contributor.authorStucchi, Michele
dc.contributor.authorRoussel, Philippe
dc.contributor.authorTokei, Zsolt
dc.contributor.authorDemuynck, Steven
dc.contributor.authorGroeseneken, Guido
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorGroeseneken, Guido
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
dc.date.accessioned2021-10-19T19:20:48Z
dc.date.available2021-10-19T19:20:48Z
dc.date.embargo9999-12-31
dc.date.issued2011
dc.identifier.issn1530-4388
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19847
dc.source.beginpage278
dc.source.endpage289
dc.source.issue2
dc.source.journalIEEE Transactions on Device and Materials Reliability
dc.source.volume11
dc.title

A comprehensive LER-aware TDDB lifetime model for advanced Cu interconnects

dc.typeJournal article
dspace.entity.typePublication
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