Publication:

Void Formation Mechanism Related to Particles During Wafer-to-Wafer Direct Bonding

Date

2022
Journal article
https://doi.org/10.1149/2162-8777/ac7662
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Published version 1.29 MB

Author(s)

Nagano, Fuya  
;
Iacovo, Serena  
;
Phommahaxay, Alain  
;
Inoue, Fumihiro  
;
Chancerel, Francois  
;
Naser, Hasan  
;
Beyer, Gerald  
;
Beyne, Eric  
;
De Gendt, Stefan  

Journal

ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY

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1673 since deposited on 2022-06-25
273last month
65last week
Acq. date: 2026-04-26

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1867 since deposited on 2022-06-25
Acq. date: 2026-04-26

Citations