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Articles
Void detection in copper interconnects using energy dispersive X-ray spectroscopy
Publication:
Void detection in copper interconnects using energy dispersive X-ray spectroscopy
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Date
2012
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Tsigkourakos, Menelaos
;
Vandervorst, Wilfried
;
Hantschel, Thomas
;
Franquet, Alexis
;
Conard, Thierry
;
Carbonell, Laure
Journal
Journal of Vacuum Science and Technology B
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1866
since deposited on 2021-10-20
Acq. date: 2025-12-16
Citations
Metrics
Views
1866
since deposited on 2021-10-20
Acq. date: 2025-12-16
Citations