Publication:

Void detection in copper interconnects using energy dispersive X-ray spectroscopy

Date

2012
Journal article
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dc.contributor.authorTsigkourakos, Menelaos
dc.contributor.authorVandervorst, Wilfried
dc.contributor.authorHantschel, Thomas
dc.contributor.authorFranquet, Alexis
dc.contributor.authorConard, Thierry
dc.contributor.authorCarbonell, Laure
dc.contributor.imecauthorVandervorst, Wilfried
dc.contributor.imecauthorHantschel, Thomas
dc.contributor.imecauthorFranquet, Alexis
dc.contributor.imecauthorConard, Thierry
dc.contributor.orcidimecHantschel, Thomas::0000-0001-9476-4084
dc.contributor.orcidimecFranquet, Alexis::0000-0002-7371-8852
dc.contributor.orcidimecConard, Thierry::0000-0002-4298-5851
dc.date.accessioned2021-10-20T17:14:35Z
dc.date.available2021-10-20T17:14:35Z
dc.date.embargo9999-12-31
dc.date.issued2012
dc.identifier.issn1071-1023
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21646
dc.source.beginpage51803
dc.source.issue5
dc.source.journalJournal of Vacuum Science and Technology B
dc.source.volume30
dc.title

Void detection in copper interconnects using energy dispersive X-ray spectroscopy

dc.typeJournal article
dspace.entity.typePublication
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