Publication:

Demonstration of a collective hybrid die-to-wafer integration

Date

2020
Proceedings Paper
https://doi.org/10.1109/ECTC32862.2020.00208
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Author(s)

Suhard, Samuel  
;
Phommahaxay, Alain  
;
Kennes, Koen  
;
Bex, Pieter  
;
Fodor, Ferenc  
;
Beyne, Eric  
;
Liebens, Maarten  
;
Slabbekoorn, John  
;
Miller, Andy  
;
Beyer, Gerald  

Journal

na

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1892 since deposited on 2021-11-02
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Acq. date: 2026-05-16

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