Publication:

Demonstration of a collective hybrid die-to-wafer integration

Date

2020

Proceedings Paper

https://doi.org/10.1109/ECTC32862.2020.00208

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Author(s)

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Phommahaxay, Alain

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Liebens, Maarten

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Slabbekoorn, John

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Journal

na

Metrics

1883 since deposited on 2021-11-02

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Acq. date: 2025-12-13