Publication:

Demonstration of a collective hybrid die-to-wafer integration

Date

2020
Proceedings Paper
https://doi.org/10.1109/ECTC32862.2020.00208
Simple item page Full metadata Statistics
 
dc.contributor.authorSuhard, Samuel
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorKennes, Koen
dc.contributor.authorBex, Pieter
dc.contributor.authorFodor, Ferenc
dc.contributor.authorBeyne, Eric
dc.contributor.authorLiebens, Maarten
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorKennes, Koen
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorFodor, Ferenc
dc.contributor.imecauthorSlabbekoorn, Maarten Liebens John
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorLiebens, Maarten
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.date.accessioned2022-01-07T11:04:01Z
dc.date.available2021-11-02T16:04:36Z
dc.date.available2022-01-07T11:04:01Z
dc.date.issued2020
dc.identifier.doi10.1109/ECTC32862.2020.00208
dc.identifier.eisbn978-1-7281-6180-8
dc.identifier.issn0569-5503
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/38151
dc.publisherIEEE COMPUTER SOC
dc.source.beginpage1315
dc.source.conference70th IEEE Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateJUN 03-30, 2020
dc.source.conferencelocationOrlando, FL, USA
dc.source.endpage1321
dc.source.journalna
dc.source.numberofpages7
dc.title

Demonstration of a collective hybrid die-to-wafer integration

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections:
Conference contributions