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Thermal expansion coefficients of ultralow-k dielectric films by cube corner indentation tests at elevated temperatures
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Thermal expansion coefficients of ultralow-k dielectric films by cube corner indentation tests at elevated temperatures
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Date
2015
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vanstreels, Kris
;
Zahedmanesh, Houman
;
Hangen, Ude
Journal
Applied Physics Letters
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1861
since deposited on 2021-10-23
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Acq. date: 2026-01-08
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Metrics
Views
1861
since deposited on 2021-10-23
1
last month
Acq. date: 2026-01-08
Citations