Thermal expansion coefficients of ultralow-k dielectric films by cube corner indentation tests at elevated temperatures

dc.contributor.author	Vanstreels, Kris
dc.contributor.author	Zahedmanesh, Houman
dc.contributor.author	Hangen, Ude
dc.contributor.imecauthor	Vanstreels, Kris
dc.contributor.imecauthor	Zahedmanesh, Houman
dc.contributor.orcidimec	Vanstreels, Kris::0000-0002-4420-0966
dc.date.accessioned	2021-10-23T00:29:34Z
dc.date.available	2021-10-23T00:29:34Z
dc.date.issued	2015
dc.identifier.issn	0003-6951
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/26114
dc.identifier.url	http://dx.doi.org/10.1063/1.4936996
dc.source.beginpage	233101
dc.source.issue	23
dc.source.journal	Applied Physics Letters
dc.source.volume	107
dc.title	Thermal expansion coefficients of ultralow-k dielectric films by cube corner indentation tests at elevated temperatures
dc.type	Journal article
dspace.entity.type	Publication
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