Publication:
Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation
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1298 since deposited on 2023-03-24
6last month
Acq. date: 2026-05-19
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Statistics
Views
1298 since deposited on 2023-03-24
6last month
Acq. date: 2026-05-19
Citations