Publication:
Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation
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1282 since deposited on 2023-03-24
5last month
Acq. date: 2026-01-07
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Views
1282 since deposited on 2023-03-24
5last month
Acq. date: 2026-01-07
Citations