Publication:
Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation
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1279 since deposited on 2023-03-24
3last month
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Acq. date: 2025-12-15
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Views
1279 since deposited on 2023-03-24
3last month
2last week
Acq. date: 2025-12-15
Citations