Publication:

Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation

Date

2023
Journal article
https://doi.org/10.1016/j.mee.2023.111947
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dc.contributor.authorSalahouelhadj, Abdellah
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVanstreels, Kris
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorSalahouelhadj, Abdellah
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSalahouelhadj, Abdellah::0000-0002-3795-1446
dc.contributor.orcidimecGonzalez, Mario::0000-0003-4374-4854
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2023-07-07T08:18:53Z
dc.date.available2023-03-24T03:42:20Z
dc.date.available2023-07-07T08:18:53Z
dc.date.issued2023
dc.identifier.doi10.1016/j.mee.2023.111947
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/41344
dc.publisherELSEVIER
dc.source.beginpageArt. 111947
dc.source.endpagena
dc.source.issueMarch
dc.source.journalMICROELECTRONIC ENGINEERING
dc.source.numberofpages11
dc.source.volume271
dc.subject.keywordsPBGA
dc.title

Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation

dc.typeJournal article
dspace.entity.typePublication
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