Publication:

Resistivity of ultra-narrow Cu interconnects fabricated with ion beam lithography

Date

2003
Proceedings Paper
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dc.contributor.authorWu, Wen
dc.contributor.authorJonckheere, Rik
dc.contributor.authorTokei, Zsolt
dc.contributor.authorStucchi, Michele
dc.contributor.authorStruyf, Herbert
dc.contributor.authorVos, Ingrid
dc.contributor.authorBender, Hugo
dc.contributor.authorMaex, Karen
dc.contributor.imecauthorJonckheere, Rik
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorVos, Ingrid
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecJonckheere, Rik::0000-0003-2211-9443
dc.date.accessioned2021-10-15T07:51:50Z
dc.date.available2021-10-15T07:51:50Z
dc.date.embargo9999-12-31
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8414
dc.source.beginpage345
dc.source.conferenceProceedings of the Advanced Metallization Conference 2002
dc.source.conferencedate1/10/2002
dc.source.conferencelocationSan Diego, CA USA
dc.source.endpage348
dc.title

Resistivity of ultra-narrow Cu interconnects fabricated with ion beam lithography

dc.typeProceedings paper
dspace.entity.typePublication
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