Publication:

Barrier/liner stacks for scaling the Cu interconnect metallization

Date

2016
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorJourdan, Nicolas
dc.contributor.authorVega Gonzalez, Victor
dc.contributor.authorWilson, Chris
dc.contributor.authorHeylen, Nancy
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorStruyf, Herbert
dc.contributor.authorCroes, Kristof
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorVega Gonzalez, Victor
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2021-10-23T16:01:34Z
dc.date.available2021-10-23T16:01:34Z
dc.date.embargo9999-12-31
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27451
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7507649
dc.source.beginpage28
dc.source.conferenceIEEE International Interconnect Technology Conference / Advanced Metallization Conference - IITC/AMC
dc.source.conferencedate23/05/2016
dc.source.conferencelocationSan Jose, CA USA
dc.source.endpage30
dc.title

Barrier/liner stacks for scaling the Cu interconnect metallization

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
33683.pdf
Size:
2.29 MB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions