Publication:

High-speed TSV integration in an active silicon photonics interposer platform

Date

2018
Proceedings Paper
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Author(s)

Bogaerts, Lieve  
;
El-Mekki, Zaid  
;
Van Huylenbroeck, Stefaan  
;
Nolmans, Philip  
;
Pantano, Nicolas  
;
Sun, Xiao  
;
Rakowski, Michal  
;
Velenis, Dimitrios  
;
Verheyen, Peter  
;
Balakrishnan, Sadhishkumar  
;
De Heyn, Peter  
;
Ban, Yoojin  
;
Srinivasan, Ashwyn  
;
Lardenois, Sebastien  
;
De Coster, Jeroen  
;
Detalle, Mikael  
;
Absil, Philippe  
;
Miller, Andy  
;
Pantouvaki, Marianna  
;
Van Campenhout, Joris  

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2024 since deposited on 2021-10-25
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