Publication:

High-speed TSV integration in an active silicon photonics interposer platform

Date

2018
Proceedings Paper
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dc.contributor.authorBogaerts, Lieve
dc.contributor.authorEl-Mekki, Zaid
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorNolmans, Philip
dc.contributor.authorPantano, Nicolas
dc.contributor.authorSun, Xiao
dc.contributor.authorRakowski, Michal
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorVerheyen, Peter
dc.contributor.authorBalakrishnan, Sadhishkumar
dc.contributor.authorDe Heyn, Peter
dc.contributor.authorBan, Yoojin
dc.contributor.authorSrinivasan, Ashwyn
dc.contributor.authorLardenois, Sebastien
dc.contributor.authorDe Coster, Jeroen
dc.contributor.authorDetalle, Mikael
dc.contributor.authorAbsil, Philippe
dc.contributor.authorMiller, Andy
dc.contributor.authorPantouvaki, Marianna
dc.contributor.authorVan Campenhout, Joris
dc.contributor.imecauthorBogaerts, Lieve
dc.contributor.imecauthorEl-Mekki, Zaid
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorNolmans, Philip
dc.contributor.imecauthorPantano, Nicolas
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorRakowski, Michal
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorVerheyen, Peter
dc.contributor.imecauthorBalakrishnan, Sadhishkumar
dc.contributor.imecauthorDe Heyn, Peter
dc.contributor.imecauthorBan, Yoojin
dc.contributor.imecauthorSrinivasan, Ashwyn
dc.contributor.imecauthorLardenois, Sebastien
dc.contributor.imecauthorDe Coster, Jeroen
dc.contributor.imecauthorDetalle, Mikael
dc.contributor.imecauthorAbsil, Philippe
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorPantouvaki, Marianna
dc.contributor.imecauthorVan Campenhout, Joris
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecDe Heyn, Peter::0000-0003-3523-7377
dc.contributor.orcidimecVan Campenhout, Joris::0000-0003-0778-2669
dc.date.accessioned2021-10-25T16:48:12Z
dc.date.available2021-10-25T16:48:12Z
dc.date.embargo9999-12-31
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30274
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8640164
dc.source.beginpage1
dc.source.conference2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)
dc.source.conferencedate15/10/2018
dc.source.conferencelocationSan Francisco, CA USA
dc.source.endpage3
dc.title

High-speed TSV integration in an active silicon photonics interposer platform

dc.typeProceedings paper
dspace.entity.typePublication
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