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In-line SEM Evaluation Technique for Cu Pad Nanotopography for Hybrid Bonding Applications
Publication:
In-line SEM Evaluation Technique for Cu Pad Nanotopography for Hybrid Bonding Applications
Date
2024
Proceedings Paper
https://doi.org/10.1109/ICSJ62869.2024.10804745
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Kasai, Hiroaki
;
Hasumi, Kazuhisa
;
Mise, Nobuyuki
;
Osaki, Mayuka
;
Chew, Soon Aik
;
Tunca Altintas, Bensu
;
Zhang, Boyao
;
Moussa, Alain
;
Charley, Anne-Laure
;
Beyne, Eric
;
Lorusso, Gian
;
Miller, Andy
;
Tanaka, Maki
Journal
N/A
Abstract
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215
since deposited on 2025-03-04
Acq. date: 2025-10-24
Citations
Metrics
Views
215
since deposited on 2025-03-04
Acq. date: 2025-10-24
Citations