Publication:

In-line SEM Evaluation Technique for Cu Pad Nanotopography for Hybrid Bonding Applications

Date

2024
Proceedings Paper
https://doi.org/10.1109/ICSJ62869.2024.10804745
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Author(s)

Kasai, Hiroaki
;
Hasumi, Kazuhisa
;
Mise, Nobuyuki
;
Osaki, Mayuka
;
Chew, Soon Aik  
;
Tunca Altintas, Bensu  
;
Zhang, Boyao  
;
Moussa, Alain  
;
Charley, Anne-Laure  
;
Beyne, Eric  
;
Lorusso, Gian  
;
Miller, Andy  
;
Tanaka, Maki

Journal

N/A

Abstract

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221 since deposited on 2025-03-04
Acq. date: 2026-02-24

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221 since deposited on 2025-03-04
Acq. date: 2026-02-24

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