Publication:
In-line SEM Evaluation Technique for Cu Pad Nanotopography for Hybrid Bonding Applications
| dc.contributor.author | Kasai, Hiroaki | |
| dc.contributor.author | Hasumi, Kazuhisa | |
| dc.contributor.author | Mise, Nobuyuki | |
| dc.contributor.author | Osaki, Mayuka | |
| dc.contributor.author | Chew, Soon Aik | |
| dc.contributor.author | Tunca Altintas, Bensu | |
| dc.contributor.author | Zhang, Boyao | |
| dc.contributor.author | Moussa, Alain | |
| dc.contributor.author | Charley, Anne-Laure | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | Lorusso, Gian | |
| dc.contributor.author | Miller, Andy | |
| dc.contributor.author | Tanaka, Maki | |
| dc.contributor.imecauthor | Chew, Soon Aik | |
| dc.contributor.imecauthor | Zhang, Boyao | |
| dc.contributor.imecauthor | Moussa, Alain | |
| dc.contributor.imecauthor | Charley, Anne-Laure | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.imecauthor | Lorusso, Gian | |
| dc.contributor.imecauthor | Miller, Andy | |
| dc.contributor.imecauthor | Tunca Altintas, Bensu | |
| dc.contributor.orcidimec | Chew, Soon Aik::0000-0003-3013-4846 | |
| dc.contributor.orcidimec | Zhang, Boyao::0000-0002-7976-0146 | |
| dc.contributor.orcidimec | Moussa, Alain::0000-0002-6377-4199 | |
| dc.contributor.orcidimec | Charley, Anne-Laure::0000-0003-4745-0167 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.contributor.orcidimec | Lorusso, Gian::0000-0003-3498-5082 | |
| dc.contributor.orcidimec | Miller, Andy::0000-0001-7048-2242 | |
| dc.contributor.orcidimec | Tunca Altintas, Bensu::0000-0001-8611-3636 | |
| dc.date.accessioned | 2025-05-12T10:03:43Z | |
| dc.date.available | 2025-03-04T19:59:53Z | |
| dc.date.available | 2025-05-12T10:03:43Z | |
| dc.date.issued | 2024 | |
| dc.identifier.doi | 10.1109/ICSJ62869.2024.10804745 | |
| dc.identifier.eisbn | 979-8-3503-7781-1 | |
| dc.identifier.isbn | 979-8-3503-7782-8 | |
| dc.identifier.issn | 2373-5449 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/45301 | |
| dc.publisher | IEEE | |
| dc.source.beginpage | 92 | |
| dc.source.conference | 13th IEEE CPMT Symposium Japan | |
| dc.source.conferencedate | NOV 13-15, 2024 | |
| dc.source.conferencelocation | Kyoto | |
| dc.source.endpage | 95 | |
| dc.source.journal | N/A | |
| dc.source.numberofpages | 4 | |
| dc.title | In-line SEM Evaluation Technique for Cu Pad Nanotopography for Hybrid Bonding Applications | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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