Publication:
Interconnect test for 3D stacked memory-on-logic
Date
| dc.contributor.author | Taouil, Mottaqiallah | |
| dc.contributor.author | Masadeh, Mahmoud | |
| dc.contributor.author | Hamdioui, Said | |
| dc.contributor.author | Marinissen, Erik Jan | |
| dc.contributor.imecauthor | Marinissen, Erik Jan | |
| dc.contributor.orcidimec | Marinissen, Erik Jan::0000-0002-5058-8303 | |
| dc.date.accessioned | 2021-10-22T06:28:09Z | |
| dc.date.available | 2021-10-22T06:28:09Z | |
| dc.date.issued | 2014-03 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/24603 | |
| dc.identifier.url | http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6800340&tag=1tp=&arnumber=6800340 | |
| dc.source.beginpage | 1 | |
| dc.source.conference | Design, Automation and Test in Europe Conference - DATE | |
| dc.source.conferencedate | 24/03/2014 | |
| dc.source.conferencelocation | Dresden Germany | |
| dc.source.endpage | 6 | |
| dc.title | Interconnect test for 3D stacked memory-on-logic | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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