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Particle adhesion and removal mechanisms during brush scrubber cleaning in post-CMP processes

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dc.contributor.authorXu, Kaidong
dc.contributor.authorVos, Rita
dc.contributor.authorVereecke, Guy
dc.contributor.authorFyen, Wim
dc.contributor.authorHolsteyns, Frank
dc.contributor.authorDoumen, Geert
dc.contributor.authorMertens, Paul
dc.contributor.authorHeyns, Marc
dc.contributor.authorVinckier, Chris
dc.contributor.authorFransaer, J.
dc.contributor.imecauthorVos, Rita
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorHolsteyns, Frank
dc.contributor.imecauthorDoumen, Geert
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorHeyns, Marc
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.date.accessioned2021-10-15T18:04:14Z
dc.date.available2021-10-15T18:04:14Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9945
dc.source.conferenceInternational Conference on Microelectronics and Interfaces - ICMI
dc.source.conferencedate1/03/2004
dc.source.conferencelocationSanta Clara, CA USA
dc.title

Particle adhesion and removal mechanisms during brush scrubber cleaning in post-CMP processes

dc.typeProceedings paper
dspace.entity.typePublication
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