Publication:
Area-selective Ru ALD by amorphous carbon modification using H plasma: from atomistic modeling to full wafer process integration
| dc.contributor.author | Zyulkov, Ivan | |
| dc.contributor.author | Voronina, Ekaterina | |
| dc.contributor.author | Krishtab, Mikhail | |
| dc.contributor.author | Voloshin, Dmitry | |
| dc.contributor.author | Chan, BT | |
| dc.contributor.author | Mankelevich, Yuri | |
| dc.contributor.author | Rakhimova, Tatyana | |
| dc.contributor.author | Armini, Silvia | |
| dc.contributor.author | De Gendt, Stefan | |
| dc.contributor.imecauthor | Zyulkov, Ivan | |
| dc.contributor.imecauthor | Krishtab, Mikhail | |
| dc.contributor.imecauthor | Chan, B. T. | |
| dc.contributor.imecauthor | Armini, Silvia | |
| dc.contributor.imecauthor | De Gendt, Stefan | |
| dc.contributor.imecauthor | Chan, BT | |
| dc.contributor.orcidext | Voronina, Ekaterina::0000-0001-7946-215X | |
| dc.contributor.orcidimec | Zyulkov, Ivan::0000-0002-4427-9168 | |
| dc.contributor.orcidimec | Krishtab, Mikhail::0000-0001-6215-8506 | |
| dc.contributor.orcidimec | Armini, Silvia::0000-0003-0578-3422 | |
| dc.contributor.orcidimec | De Gendt, Stefan::0000-0003-3775-3578 | |
| dc.contributor.orcidimec | Chan, BT::0000-0003-2890-0388 | |
| dc.date.accessioned | 2022-01-06T13:00:49Z | |
| dc.date.available | 2021-11-02T16:03:56Z | |
| dc.date.available | 2022-01-06T13:00:49Z | |
| dc.date.issued | 2020 | |
| dc.identifier.doi | 10.1039/d0ma00462f | |
| dc.identifier.issn | 2633-5409 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/38099 | |
| dc.publisher | ROYAL SOC CHEMISTRY | |
| dc.source.beginpage | 3049 | |
| dc.source.endpage | 3057 | |
| dc.source.issue | 8 | |
| dc.source.journal | MATERIALS ADVANCES | |
| dc.source.numberofpages | 9 | |
| dc.source.volume | 1 | |
| dc.subject.keywords | LAYER DEPOSITION | |
| dc.subject.keywords | FILMS | |
| dc.subject.keywords | RUTHENIUM | |
| dc.subject.keywords | RUO4-PRECURSOR | |
| dc.title | Area-selective Ru ALD by amorphous carbon modification using H plasma: from atomistic modeling to full wafer process integration | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | Original bundle
| |
| Publication available in collections: |