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Localization of Electrical Defects in Hybrid Bonding Interconnect Structures by Scanning Photocapacitance Microscopy
Publication:
Localization of Electrical Defects in Hybrid Bonding Interconnect Structures by Scanning Photocapacitance Microscopy
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Date
2021
Journal article
https://doi.org/10.1109/TIM.2021.3108531
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Jacobs, Kristof J.P.
;
Stucchi, Michele
;
Beyne, Eric
Journal
IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT
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1121
since deposited on 2023-06-20
Acq. date: 2025-12-16
Citations
Metrics
Views
1121
since deposited on 2023-06-20
Acq. date: 2025-12-16
Citations