Localization of Electrical Defects in Hybrid Bonding Interconnect Structures by Scanning Photocapacitance Microscopy

dc.contributor.author	Jacobs, Kristof J.P.
dc.contributor.author	Stucchi, Michele
dc.contributor.author	Beyne, Eric
dc.contributor.imecauthor	Jacobs, Kristof J.P.
dc.contributor.imecauthor	Stucchi, Michele
dc.contributor.imecauthor	Beyne, Eric
dc.contributor.orcidimec	Jacobs, Kristof J. P.::0000-0002-1081-3633
dc.contributor.orcidimec	Stucchi, Michele::0000-0002-7848-0492
dc.contributor.orcidimec	Beyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimec	Jacobs, Kristof J.P.::0000-0002-1081-3633
dc.date.accessioned	2023-08-08T07:50:19Z
dc.date.available	2023-06-20T10:37:17Z
dc.date.available	2023-06-29T11:03:32Z
dc.date.available	2023-08-08T07:50:19Z
dc.date.issued	2021
dc.identifier.doi	10.1109/TIM.2021.3108531
dc.identifier.issn	0018-9456
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/41973
dc.publisher	IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage	1
dc.source.endpage	7
dc.source.issue	1
dc.source.journal	IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT
dc.source.numberofpages	7
dc.source.volume	70
dc.subject.keywords	SILICON
dc.subject.keywords	CAPACITANCE
dc.title	Localization of Electrical Defects in Hybrid Bonding Interconnect Structures by Scanning Photocapacitance Microscopy
dc.type	Journal article
dspace.entity.type	Publication
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