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Articles
Grain growth in copper interconnect lines
Publication:
Grain growth in copper interconnect lines
Date
2004
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Wu, Wen
;
Ernur, Didem
;
Brongersma, Sywert
;
Van Hove, Marleen
;
Maex, Karen
Journal
Microelectronic Engineering
Abstract
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1917
since deposited on 2021-10-15
Acq. date: 2025-10-23
Citations
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Views
1917
since deposited on 2021-10-15
Acq. date: 2025-10-23
Citations