Publication:
Grain growth in copper interconnect lines
Date
| dc.contributor.author | Wu, Wen | |
| dc.contributor.author | Ernur, Didem | |
| dc.contributor.author | Brongersma, Sywert | |
| dc.contributor.author | Van Hove, Marleen | |
| dc.contributor.author | Maex, Karen | |
| dc.contributor.imecauthor | Ernur, Didem | |
| dc.contributor.imecauthor | Brongersma, Sywert | |
| dc.contributor.imecauthor | Maex, Karen | |
| dc.contributor.orcidimec | Brongersma, Sywert::0000-0002-1755-3897 | |
| dc.date.accessioned | 2021-10-15T18:02:10Z | |
| dc.date.available | 2021-10-15T18:02:10Z | |
| dc.date.issued | 2004 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/9939 | |
| dc.source.beginpage | 190 | |
| dc.source.endpage | 194 | |
| dc.source.issue | 1_4 | |
| dc.source.journal | Microelectronic Engineering | |
| dc.source.volume | 76 | |
| dc.title | Grain growth in copper interconnect lines | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |