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Two component additive plating for through-silicon-via fillings
Publication:
Two component additive plating for through-silicon-via fillings
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Date
2009
Proceedings Paper
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18762.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Luhn, Ole
;
Radisic, Alex
;
Vereecken, Philippe
;
Van Hoof, Chris
;
Celis, Jean-Pierre
;
Swinnen, Bart
;
Ruythooren, Wouter
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1870
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Acq. date: 2025-12-15
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Metrics
Views
1870
since deposited on 2021-10-18
2
last month
Acq. date: 2025-12-15
Citations