Publication:

Two component additive plating for through-silicon-via fillings

Date

2009
Proceedings Paper
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dc.contributor.authorLuhn, Ole
dc.contributor.authorRadisic, Alex
dc.contributor.authorVereecken, Philippe
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorCelis, Jean-Pierre
dc.contributor.authorSwinnen, Bart
dc.contributor.authorRuythooren, Wouter
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.date.accessioned2021-10-18T00:17:24Z
dc.date.available2021-10-18T00:17:24Z
dc.date.embargo9999-12-31
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15765
dc.source.beginpage243
dc.source.conferenceAdvanced Metallization Conference 2008 (AMC 2008)
dc.source.conferencedate23/09/2008
dc.source.conferencelocationSan Diego, CA USA
dc.source.endpage247
dc.title

Two component additive plating for through-silicon-via fillings

dc.typeProceedings paper
dspace.entity.typePublication
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