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The development of epoxy polymer surface roughness due to wet chemical treatments and its relevance to adhesion of electrochemically deposited copper
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The development of epoxy polymer surface roughness due to wet chemical treatments and its relevance to adhesion of electrochemically deposited copper
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Date
2005-06
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Siau, S.
;
Vervaet, A.
;
Van Calster, Andre
;
Baert, D.
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1851
since deposited on 2021-10-16
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last month
Acq. date: 2025-12-15
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Metrics
Views
1851
since deposited on 2021-10-16
2
last month
Acq. date: 2025-12-15
Citations