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The development of epoxy polymer surface roughness due to wet chemical treatments and its relevance to adhesion of electrochemically deposited copper

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dc.contributor.authorSiau, S.
dc.contributor.authorVervaet, A.
dc.contributor.authorVan Calster, Andre
dc.contributor.authorBaert, D.
dc.contributor.imecauthorVan Calster, Andre
dc.date.accessioned2021-10-16T05:01:54Z
dc.date.available2021-10-16T05:01:54Z
dc.date.issued2005-06
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11199
dc.source.beginpage22
dc.source.conference5th International Symposium on Polymer Surface Modification
dc.source.conferencedate20/06/2005
dc.source.conferencelocationToronto Canada
dc.title

The development of epoxy polymer surface roughness due to wet chemical treatments and its relevance to adhesion of electrochemically deposited copper

dc.typeProceedings paper
dspace.entity.typePublication
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