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Articles
Edge trimming induced defects on direct bonded wafers
Publication:
Edge trimming induced defects on direct bonded wafers
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Date
2018
Journal article
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Inoue, Fumihiro
;
Jourdain, Anne
;
Peng, Lan
;
Phommahaxay, Alain
;
Kosemura, Daisuke
;
De Wolf, Ingrid
;
Rebibis, Kenneth June
;
Miller, Andy
;
Sleeckx, Erik
;
Beyne, Eric
Journal
Journal of Electronic Packaging
Abstract
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2016
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Acq. date: 2025-12-11
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Views
2016
since deposited on 2021-10-25
1
last month
Acq. date: 2025-12-11
Citations