Publication:

Edge trimming induced defects on direct bonded wafers

Date

2018
Journal article
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dc.contributor.authorInoue, Fumihiro
dc.contributor.authorJourdain, Anne
dc.contributor.authorPeng, Lan
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorKosemura, Daisuke
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorSleeckx, Erik
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-25T20:10:12Z
dc.date.available2021-10-25T20:10:12Z
dc.date.issued2018
dc.identifier.issn1043-7398
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30938
dc.identifier.urlhttp://electronicpackaging.asmedigitalcollection.asme.org/article.aspx?articleid=2679409
dc.source.beginpage31004
dc.source.issue3
dc.source.journalJournal of Electronic Packaging
dc.source.volume140
dc.title

Edge trimming induced defects on direct bonded wafers

dc.typeJournal article
dspace.entity.typePublication
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