Publication:

Correlation between Cu microstructure and TSV Cu pumping

Date

2014
Proceedings Paper
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dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorVan der Donck, Tom
dc.contributor.authorCroes, Kristof
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2021-10-22T01:07:07Z
dc.date.available2021-10-22T01:07:07Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23710
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6897349&contentType=Conference+Publications
dc.source.beginpage613
dc.source.conferenceIEEE Electronic Components and Technology Conference
dc.source.conferencedate27/05/2014
dc.source.conferencelocationLake Buena Vista USA
dc.source.endpage619
dc.title

Correlation between Cu microstructure and TSV Cu pumping

dc.typeProceedings paper
dspace.entity.typePublication
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