Publication:
CMOS compatible anodization process for low cost high density capacitors
Date
| dc.contributor.author | Detalle, Mikael | |
| dc.contributor.author | Rakowski, Michal | |
| dc.contributor.author | Potoms, Goedele | |
| dc.contributor.author | Mercha, Abdelkarim | |
| dc.contributor.author | de Potter de ten Broeck, Muriel | |
| dc.contributor.author | Phommahaxay, Alain | |
| dc.contributor.author | Sabuncuoglu Tezcan, Deniz | |
| dc.contributor.author | Soussan, Philippe | |
| dc.contributor.imecauthor | Detalle, Mikael | |
| dc.contributor.imecauthor | Rakowski, Michal | |
| dc.contributor.imecauthor | Potoms, Goedele | |
| dc.contributor.imecauthor | Mercha, Abdelkarim | |
| dc.contributor.imecauthor | de Potter de ten Broeck, Muriel | |
| dc.contributor.imecauthor | Phommahaxay, Alain | |
| dc.contributor.imecauthor | Sabuncuoglu Tezcan, Deniz | |
| dc.contributor.imecauthor | Soussan, Philippe | |
| dc.contributor.orcidimec | Mercha, Abdelkarim::0000-0002-2174-6958 | |
| dc.contributor.orcidimec | Sabuncuoglu Tezcan, Deniz::0000-0002-9237-7862 | |
| dc.contributor.orcidimec | Soussan, Philippe::0000-0002-1347-6978 | |
| dc.date.accessioned | 2021-10-18T16:01:26Z | |
| dc.date.available | 2021-10-18T16:01:26Z | |
| dc.date.embargo | 9999-12-31 | |
| dc.date.issued | 2010 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/17015 | |
| dc.source.beginpage | 107 | |
| dc.source.conference | Processing, Materials, and Integration of Damascene and 3D Interconnects | |
| dc.source.conferencedate | 10/10/2010 | |
| dc.source.conferencelocation | Las Vegas, NV USA | |
| dc.source.endpage | 115 | |
| dc.title | CMOS compatible anodization process for low cost high density capacitors | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | Original bundle
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| Publication available in collections: |