Publication:
High aspect ratio via etch development for Cu nails in 3-D-stacked ICs
Date
| dc.contributor.author | Van Aelst, Joke | |
| dc.contributor.author | Struyf, Herbert | |
| dc.contributor.author | Boullart, Werner | |
| dc.contributor.author | Vanhaelemeersch, Serge | |
| dc.contributor.imecauthor | Van Aelst, Joke | |
| dc.contributor.imecauthor | Struyf, Herbert | |
| dc.contributor.imecauthor | Boullart, Werner | |
| dc.contributor.imecauthor | Vanhaelemeersch, Serge | |
| dc.contributor.orcidimec | Boullart, Werner::0000-0001-7614-2097 | |
| dc.contributor.orcidimec | Vanhaelemeersch, Serge::0000-0003-2102-7395 | |
| dc.date.accessioned | 2021-10-17T11:31:07Z | |
| dc.date.available | 2021-10-17T11:31:07Z | |
| dc.date.issued | 2008 | |
| dc.identifier.issn | 0040-6090 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/14595 | |
| dc.identifier.url | www.sciencedirect.com | |
| dc.source.beginpage | 3502 | |
| dc.source.endpage | 3506 | |
| dc.source.issue | 11 | |
| dc.source.journal | Thin Solid Films | |
| dc.source.volume | 516 | |
| dc.title | High aspect ratio via etch development for Cu nails in 3-D-stacked ICs | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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