Publication:

Backside Power Delivery With Relaxed Overlay for Backside Patterning Using Extreme Wafer Thinning and Molybdenum-Filled Slit Nano Through Silicon Vias

Date

2024
Journal article
https://doi.org/10.1109/TED.2024.3487080
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dc.contributor.authorZhao, Peng
dc.contributor.authorWitters, Liesbeth
dc.contributor.authorJourdain, Anne
dc.contributor.authorStucchi, Michele
dc.contributor.authorJourdan, Nicolas
dc.contributor.authorMaes, J. W.
dc.contributor.authorBana, H.
dc.contributor.authorZhu, C.
dc.contributor.authorChukka, Rami
dc.contributor.authorSebaai, Farid
dc.contributor.authorVandersmissen, Kevin
dc.contributor.authorHeylen, Nancy
dc.contributor.authorMontero Alvarez, Daniel
dc.contributor.authorWang, S.
dc.contributor.authorD'havé, Koen
dc.contributor.authorSchleicher, F.
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorBeyer, Gerald
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorWang, S.
dc.contributor.imecauthorZhao, Peng
dc.contributor.imecauthorWitters, Liesbeth
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorChukka, Rami
dc.contributor.imecauthorSebaai, Farid
dc.contributor.imecauthorVandersmissen, Kevin
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorMontero Alvarez, Daniel
dc.contributor.imecauthorD'havé, Koen
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecZhao, Peng::0000-0002-4850-9354
dc.contributor.orcidimecWitters, Liesbeth::0000-0002-0772-5501
dc.contributor.orcidimecJourdain, Anne::0000-0002-7610-0513
dc.contributor.orcidimecStucchi, Michele::0000-0002-7848-0492
dc.contributor.orcidimecJourdan, Nicolas::0009-0005-4798-1736
dc.contributor.orcidimecChukka, Rami::0000-0001-6012-9357
dc.contributor.orcidimecSebaai, Farid::0009-0008-0186-6101
dc.contributor.orcidimecVandersmissen, Kevin::0009-0008-7831-564X
dc.contributor.orcidimecHeylen, Nancy::0009-0008-0490-0993
dc.contributor.orcidimecMontero Alvarez, Daniel::0000-0001-9966-0399
dc.contributor.orcidimecD'havé, Koen::0000-0002-5195-9241
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecBeyer, Gerald::0009-0001-0376-866X
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.contributor.orcidimecBeyne, Sofie::0000-0002-5138-0280
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2025-07-14T13:14:19Z
dc.date.available2024-11-28T16:44:40Z
dc.date.available2025-07-14T13:14:19Z
dc.date.issued2024
dc.description.wosFundingTextThe authors gratefully acknowledge the imec 3-D system integration program members and partners, the imec pilot line, the electrical measurement team, Materials Characterization Analysis Team, and ICT for their support.
dc.identifier.doi10.1109/TED.2024.3487080
dc.identifier.issn0018-9383
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44852
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage7963
dc.source.endpage7969
dc.source.issue12
dc.source.journalIEEE TRANSACTIONS ON ELECTRON DEVICES
dc.source.numberofpages7
dc.source.volume71
dc.title

Backside Power Delivery With Relaxed Overlay for Backside Patterning Using Extreme Wafer Thinning and Molybdenum-Filled Slit Nano Through Silicon Vias

dc.typeJournal article
dspace.entity.typePublication
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