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Conference contributions
Scaling and readiness of underlayers for high-NA EUV lithography
Publication:
Scaling and readiness of underlayers for high-NA EUV lithography
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Date
2022
Proceedings Paper
https://doi.org/10.1117/12.2645864
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Fallica, Roberto
;
De Simone, Danilo
;
Chen, Steven
;
Safdar, Muhammad
;
Suh, Hyo Seon
Journal
Proceedings of SPIE
Abstract
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Metrics
Downloads
801
since deposited on 2023-03-22
45
last month
6
last week
Acq. date: 2025-12-15
Views
1324
since deposited on 2023-03-22
Acq. date: 2025-12-15
Citations