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Atomic layer deposition of ruthenium with TiN interface for sub-10nm advanced interconnects beyond copper
Publication:
Atomic layer deposition of ruthenium with TiN interface for sub-10nm advanced interconnects beyond copper
Date
2016-09
Journal article
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Wen, Liang Gong
;
Roussel, Philippe
;
Varela Pedreira, Olalla
;
Briggs, Basoene
;
Groven, Benjamin
;
Dutta, Shibesh
;
Popovici, Mihaela Ioana
;
Heylen, Nancy
;
Ciofi, Ivan
;
Vanstreels, Kris
;
Osterberg, Frederik
;
Hansen, Ole
;
Petersen, Dirch H.
;
Opsomer, Karl
;
Detavernie, Christophe
;
Wilson, Chris
;
Van Elshocht, Sven
;
Croes, Kristof
;
Bommels, Jurgen
;
Tokei, Zsolt
;
Adelmann, Christoph
Journal
ACS Applied Materials & Interfaces
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2021
since deposited on 2021-10-23
Acq. date: 2025-10-24
Citations
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Views
2021
since deposited on 2021-10-23
Acq. date: 2025-10-24
Citations