Publication:

Atomic layer deposition of ruthenium with TiN interface for sub-10nm advanced interconnects beyond copper

Date

2016-09
Journal article
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Author(s)

Wen, Liang Gong
;
Roussel, Philippe  
;
Varela Pedreira, Olalla  
;
Briggs, Basoene  
;
Groven, Benjamin  
;
Dutta, Shibesh
;
Popovici, Mihaela Ioana  
;
Heylen, Nancy  
;
Ciofi, Ivan  
;
Vanstreels, Kris  
;
Osterberg, Frederik
;
Hansen, Ole
;
Petersen, Dirch H.
;
Opsomer, Karl  
;
Detavernie, Christophe
;
Wilson, Chris  
;
Van Elshocht, Sven  
;
Croes, Kristof  
;
Bommels, Jurgen
;
Tokei, Zsolt  
;
Adelmann, Christoph  

Journal

ACS Applied Materials & Interfaces

Abstract

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2025 since deposited on 2021-10-23
Acq. date: 2026-01-09

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2025 since deposited on 2021-10-23
Acq. date: 2026-01-09

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