Publication:

Atomic layer deposition of ruthenium with TiN interface for sub-10nm advanced interconnects beyond copper

Date

2016-09
Journal article
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dc.contributor.authorWen, Liang Gong
dc.contributor.authorRoussel, Philippe
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorBriggs, Basoene
dc.contributor.authorGroven, Benjamin
dc.contributor.authorDutta, Shibesh
dc.contributor.authorPopovici, Mihaela Ioana
dc.contributor.authorHeylen, Nancy
dc.contributor.authorCiofi, Ivan
dc.contributor.authorVanstreels, Kris
dc.contributor.authorOsterberg, Frederik
dc.contributor.authorHansen, Ole
dc.contributor.authorPetersen, Dirch H.
dc.contributor.authorOpsomer, Karl
dc.contributor.authorDetavernie, Christophe
dc.contributor.authorWilson, Chris
dc.contributor.authorVan Elshocht, Sven
dc.contributor.authorCroes, Kristof
dc.contributor.authorBommels, Jurgen
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorBriggs, Basoene
dc.contributor.imecauthorGroven, Benjamin
dc.contributor.imecauthorPopovici, Mihaela Ioana
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorCiofi, Ivan
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorOpsomer, Karl
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorVan Elshocht, Sven
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorAdelmann, Christoph
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
dc.contributor.orcidimecGroven, Benjamin::0000-0002-5781-7594
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecVan Elshocht, Sven::0000-0002-6512-1909
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecAdelmann, Christoph::0000-0002-4831-3159
dc.date.accessioned2021-10-23T17:09:30Z
dc.date.available2021-10-23T17:09:30Z
dc.date.issued2016-09
dc.identifier.issn1944-8244
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27584
dc.identifier.urlhttp://pubs.acs.org/doi/abs/10.1021/acsami.6b07181
dc.source.beginpage26119
dc.source.endpage26125
dc.source.issue39
dc.source.journalACS Applied Materials & Interfaces
dc.source.volume9
dc.title

Atomic layer deposition of ruthenium with TiN interface for sub-10nm advanced interconnects beyond copper

dc.typeJournal article
dspace.entity.typePublication
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