Publication:

Reducing the electrodeposition time for filling microvias with copper for 3D technology

Date

2008
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorLuhn, Ole
dc.contributor.authorRadisic, Alex
dc.contributor.authorVereecken, Philippe
dc.contributor.authorSwinnen, Bart
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorCelis, Jean-Pierre
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.date.accessioned2021-10-17T08:34:57Z
dc.date.available2021-10-17T08:34:57Z
dc.date.embargo9999-12-31
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14075
dc.source.beginpage866
dc.source.conference58th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate27/05/2008
dc.source.conferencelocationLake Buena Vista, FL USA
dc.source.endpage870
dc.title

Reducing the electrodeposition time for filling microvias with copper for 3D technology

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
15368.pdf
Size:
2.66 MB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions