Publication:

New methods and instrumentation for functional, yield and reliability testing of MEMS on device, chip and wafer level

Date

2009
Proceedings Paper
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dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorDe Coster, Jeroen
dc.contributor.authorCherman, Vladimir
dc.contributor.authorCzarnecki, Piotr
dc.contributor.authorKalicinski, Stanislaw
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorSangameswaran, Sandeep
dc.contributor.authorVanstreels, Kris
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorDe Coster, Jeroen
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorCzarnecki, Piotr
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.date.accessioned2021-10-17T21:50:34Z
dc.date.available2021-10-17T21:50:34Z
dc.date.embargo9999-12-31
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15193
dc.source.beginpage73620N
dc.source.conferenceSPIE Europe Microtechnologies for the New Millennium
dc.source.conferencedate4/05/2009
dc.source.conferencelocationDresden Germany
dc.title

New methods and instrumentation for functional, yield and reliability testing of MEMS on device, chip and wafer level

dc.typeProceedings paper
dspace.entity.typePublication
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